Thanks to our policy of continuous investment in state-of-the-art equipment, our machines have class-leading Surface Mount Technology (SMT), optically-aligned flexible placement capability for SMT component types, including 01005 cases sized up to high-density fine pitch devices such as QFP, BGA, uBGA, QFN, CSP and large odd-form components in excess of 100 x 50mm.
We supply prototype to volume.
Surface Mount Assembly
Class-leading Surface Mount Technology (SMT) optically-aligned flexible placement capability for all SMT component types including:
Optically-aligned flexible placement down to 0201.
High-density fine pitch devices including QFP, BGA, Micro BGA (uBGA), QFN, CSP and large odd-form components in excess of 100 x 50 mm.
Through Hole Technology (THT) component assembly.
Assembly to J-STD-001.
EMS offers, as standard, Automated Optical Inspection (AOI) on all SMT production batches.
Fully Automated Optical Inspection (AOI) of all SMT components, offering component package recognition, part number check and solder joint inspection.
Inspection to IPC-A-610 Class 2 as standard, Class 3 available on request.
Flexible – EMS’ Prototyping services offer flexibility to suit any requirement.
Adaptable – EMS will offer a solution to meet the target price which suits the complexity and turnaround time.
Efficient – EMS’ Prototyping service can be combined with our Quick Turn Service to deliver prototypes within 10 working days for standard design.
Our Trident ZDO Aqueous Cleaner is capable of adapting from low to high-volume batch production, containing adjustable board racks to handle PCBs up to 60mm in length for automatic wash, rinse and dry cycles. It also has advanced statistical process control (SPC), data-logging with barcode scanner, built-in programmable cleanliness verification, testing via a resistivity meter and automatic dosing and mixing system.
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Contact our Sales team today to discuss your requirement.