EMS

SMT Assembly & AOI

SMT Assembly

Our extensive range of Surface Mount Technology solutions offers a flexible, high technology high mix environment, these solutions include;

• DEK 265/LT stencil printer with fiducial alignment.
• Panasonic MV2F optically aligned chip components down to 0402”.
• Panasonic CM101-D optically aligned flexible placement down to 01005” and including BGA, uBGA, QFN, CSP, POP (Package On Package) and large odd-form components in excess of 100 x 50 mm.
• Elite Engineering TSC1008 12 zone convection reflow oven with detailed profiling, chart recording and data logging.  The 12 zones allow for optimal profile control and provides excellent multi-layer capability.
• BGA, uBGA, QFN, CSP down to a lead pitch of 0.008” placement and re-work capability via the ERSA IR/PL 550 Precision Placement System;
  • The ERSA IR/PL 550 uses a powerful focused infrared reflow system.
  • A vision system ensures precision placement and allows the operator to visually inspect the reflow.

Utilising our range of Panasonic SMT machines we can place up to 32,000 components per hour all placed by optical alignment to ensure the highest quality standards.

We offer full RoHS compliance with no clean processes on all assemblies manufactured to IPC-A-610 Class 2 as standard, Class 3 available on request.

AOI Inspection

EMS offer, as standard, Automated Optical Inspection (AOI) on all SMT production batches.  Our Mirtec MV-2HTL AOI machine offers flexibility, quick simple setup and is capable of optically inspecting;

• Passive chip components;
  • Component location & orientation
  • Component values
  • Solder fillets of individual terminals
• Discretes, IC’s and connectors
  • Component location & orientation
  • Component part numbers
  • Solder fillets of individual leads
  • Lead spacing inspection
  • Solder bridge inspection

For prototype assemblies and sample batch inspection we use a Mantis Elite stereo microscope with a camera option used for training and analysis.