Surface Mount Assembly

Our extensive range of Surface Mount Technology (SMT) solutions offers a flexible, high technology high mix environment, these solutions include;

DEK Horizon 03iX stencil printer

  • With fiducial alignment and paste on pad inspection.
  • Maximum PCB length of 620mm.
  • Fitted with HawkEye 1700 for up to 100% paste on pad inspection

Panasonic CM101-D (2 off)

  • Optically aligned flexible placement down to 0201" as standard (with 01005” on request).
  • Including capability to place BGA, uBGA, QFN, CSP, POP (Package On Package) and large odd-form components in excess of 100 x 50 mm.

Heller 1809 MKII Convection Reflow Oven

  • Integrated user friendly software with excellent zone and profile control for optimal PCB reflow and control.
  • 9 top and 9 bottom heating zones, providing a total of 18 heaters.
  • 2 cooling zones.
  • Excellent energy efficiency and short heat up times.
  • High throughout capability.
  • Complemented by SolderStar Pro R-0625P Reflow Profiler.

MEK PowerSpector FDAz 650L AOI

  • With 18.75u HD Camera with telecentric optics and eight off 10u side cameras for side and edge inspection of components.
  • Includes, omnidirectional multi angle, multi-colour LED lighting with the capability to test a range of criteria on all types of solder joints
  • BGA, uBGA, QFN, CSP down to a lead pitch of 0.008” placement and re-work capability via the ERSA IR/PL 550 Precision Placement System;
  • The ERSA IR/PL 550 uses a powerful focused infrared reflow system.
  • A vision system ensures precision placement and allows the operator to visually inspect the reflow.

Utilising our range of Panasonic SMT machines we can place up to 32,000 components per hour all placed by optical alignment to ensure the highest quality standards.

We offer full RoHS compliance with no clean processes on all assemblies manufactured to IPC-A-610 Class 2 as standard, Class 3 available on request.

AOI Inspection

EMS offer, as standard, Automated Optical Inspection (AOI) on all SMT production batches.  Our MEK PowerSpector FDAz 650L and Mirtec MV-2HTL AOI machines offer flexibility, quick simple setup and are capable of optically inspecting;

  • Passive chip components;
    • Component location & orientation
    • Component values
    • Solder fillets of individual terminals
  • Discretes, IC’s and connectors;
    • Component location & orientation
    • Component part numbers
    • Solder fillets of individual leads
    • Lead spacing inspection
    • Solder  bridge inspection

For prototype assemblies and sample batch inspection we use a Mantis Elite stereo microscope with a camera option used for training and analysis.