EMS

Electronic Manufacturing Solutions

SMT Assembly & AOI

SMT Assembly

Our extensive range of Surface Mount Technology solutions offers a flexible, high technology high mix environment, these solutions include:

  • Panasonic MV2F optically aligned chip components down to 0201.
  • Panasonic MPAG optically aligned fine and ultra-fine pitch QFP, QFN, CSP, CGA and PGA placement.
  • BGA, Micro-BGA, Micro-FCBGA down to a lead pitch of 8 thou.  Placement and re-work capability via the ERSA IR/PL 550 Precision Placement System:
    • The ERSA IR/PL 550 uses a powerful focused infrared reflow system.
    • A vision system ensures precision placement and allows the operator to visually inspect the reflow.

Utilising our range of Panasonic SMT machines we can place up to 32,000 components per hour all placed by optical alignment to ensure the highest quality standards.

We offer full RoHS compliance with no clean processes on all assemblies manufactured to IPC 610 Class 2 as standard, Class 3 available on request.

The ERSA IR/PL 550 can also be used for SMT Repair, for further details please view our BGA Presentation;


AOI Inspection

EMS offer, as standard, Automated Optical Inspection (AOI) on all SMT production batches.  With a range of automated test solutions as an option.  Our Mirtec MV-2HTL AOI machine offers flexibility and quick simple setup and is capable of optically inspecting;

  • Passive chip components;
    • Component location & orientation
    • Component values
    • Solder fillets of individual terminals
  • Discretes, IC’s and connectors
    • Component location & orientation
    • Component part numbers
    • Solder fillets of individual leads
    • Lead spacing inspection
    • Solder bridge inspection

For prototype assemblies and sample batch inspection we use a Mantis ‘Original’ with x4 zoom magnification and a TS-3 Zoom Stereo Microscope with x60 magnification.